Italy

**Please read the paper on the following link:**

https://1worldcontent.com/ess/9197.pdf

**Abstract:**

We here report a joint experimental and theoretical analysis of polarization switching in ferroelectric tunnel junctions. Our results show that the injection and trapping of charge into the ferroelectricdielectric stack has a large influence on the polarization switching. Our results are relevant to the physical understanding and to the design of the devices, and for both memory and memristor applications.

ESSCIRC ESSDERC 2021

Polarization Switching and Interface Charges in BEOL Compatible Ferroelectric Tunnel Junctions

synaptic devices

ferroelectricity

neuromorphic computing

**[DOWNLOAD THE DRC 2021 DIGEST](https://drive.google.com/file/d/17_-pkYf4IBbVuNYgohTf0iZJORVGp_uN/view?usp=sharing)**

**[DOWNLOAD A COPY OF THE FINAL DRC PROGRAM](https://drive.google.com/file/d/1Ek8UIDCowpLq0z2hXav5tn67FboxS03N/view?usp=sharing)**

For almost eight decades, the Device Research Conference (DRC) has brought together leading scientists, researchers and students to share their latest discoveries in device science, technology and modeling. Notably, many of the first public disclosures of key device technologies were made at the DRC. This year marks the 79th anniversary of the DRC—the longest running device research meeting in the world. As we commemorate this meeting, the high-caliber technical sessions will be highlighted by plenary talks and invited talks by international research pioneers and leaders behind modern electronic technology.

Given the ongoing global health concerns associated with COVID-19 (Coronavirus), the DRC leadership has decided to hold the 2021 Device Research Conference in a virtual (online) format. This follows an enormously successful 2020 DRC held virtually, in which we had record attendance and worldwide participation of more than 875 attendees from 33 countries.

The 2021 Conference will feature:

* Informative, timely short courses in rapidly developing fields
* Oral and poster presentations on electronic/photonic device experiments and simulations
* Plenary and invited presentations given by worldwide leaders
* Evening “rump” session
* Strong student participation and Student Paper Awards

DRC is held in coordination with the Electronic Materials Conference (EMC), which will occur the same week, from June 23-25. As has happened in person in past years, in 2021, the virtual DRC and EMC sessions on the shared day, Wednesday, June 23, will be open to all attendees from both conferences. This recognizes the strong interaction between device and electronic materials research and provides fruitful exchanges of information between attendees of both Conferences. For information on the 63rd Electronic Materials Conference, please visit the [EMC 2021 website.](https://www.mrs.org/63rd-emc/)

2021 DRC individual presentation videos will become available in Underline at the end of each technical session. A recording of each full live session with Q&A will be posted later during the conference. To facilitate re-viewing of recorded talks and sessions, the DRC Underline site will remain open through 11:59pm (US EDT) on July 7th. DRC Conference registration will remain open at www.mrs.org/drc-2021/registration through June 30th.

Thank you for joining us at the 2021 Device Research Conference!

**General Chair**
 Zhihong Chen, Purdue University

**Technical Program Chair**
 Becky (R.L.) Peterson, University of Michigan

**Technical Program Vice-Chair**
 Gregg Jessen, BAE Systems

You can register for the 79th Device Research Conference with the following link. https://www.mrs.org/drc-2021

DRC 2021

For almost eight decades, the Device Research Conference (DRC) has brought together leading scientists, researchers and students to share their latest discoveries in device science, technology and modeling. Notably, many of the first public disclosures of key device technologies were made at the DRC. This year marks the 79th anniversary of the DRC—the longest running device research meeting in the world. As we commemorate this meeting, the high-caliber technical sessions will be highlighted by plenary talks and invited talks by international research pioneers and leaders behind modern electronic technology.

technical paper

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
* 3 keynote presentations ESSCIRC
* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021 
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021 
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021 
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021 
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

To access ESSCIRC ESSDERC 2021, you must pre-register for the conference.  Instructions on how to access the event will be provided directly to attendees and included on the ESSCIRC ESSDERC conference website. [Register now](https://www.esscirc-essderc2021.org/).

Please register for the ESSCIRC conference to join the event.

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.





**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9199382

**Abstract:**

The Von-Neumann bottleneck is a clear limitation for data-intensive applications, bringing in-memory computing (IMC) solutions to the fore. Since large data sets are usually stored in nonvolatile memory (NVM), various solutions have been proposed based on emerging memories, such as OxRAM, that rely mainly on area hungry, one transistor (1T) one OxRAM (1R) bit-cell. To tackle this area issue, while keeping the programming control provided by 1T1R bit-cell, we propose to combine gate-allaround stacked junctionless nanowires (1JL) and OxRAM (1R) technology to create a 3-D memory pillar with ultrahigh density. Nanowire junctionless transistors have been fabricated, characterized, and simulated to define current conditions for the whole pillar. Finally, based on Simulation Program with Integrated Circuit Emphasis (SPICE) simulations, we demonstrated successfully scouting logic operations up to three-pillar layers, with one operand per layer.

Ultrahigh-Density 3-D Vertical RRAM with Stacked Junctionless Nanowires for In-Memory-Computing Applications

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9212585

**Abstract:**

We propose, for the first time, an indium gallium zinc oxide (IGZO)-based 2T1C compute cell (IGZO-cell) for analog in-memory computing. To assess the impact of an IGZO-cell-based array including the periphery on power and accuracy, a PyTorch framework was developed to analytically modeled analog components. The results are reported for a ResNet20 network on the Canadian Institute For Advanced Research-10 (CIFAR-10) benchmark. The state-of-the-art energy efficiency of 15 peta operations per second (POPS)/W including the periphery is achieved by using our proposed IGZO-cell with CMOS compatibility. Finally, it is shown that, with a properly trained neural network model, there is no degradation of test accuracy with 10% device to device variability for the IGZO devices.

IGZO-Based Compute Cell for Analog In- Memory Computing—DTCO Analysis to Enable Ultralow-Power Ai at Edge

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9144248

**Abstract:**

This letter proposes a C-SRAM combining IMC/NMC approaches to be used by a scalar processor as an energyefficient vector processing unit. The proposed circuit is designed with a two-port foundry bitcell and an adjustable form factor to facilitate physical implementation in a SoC. The 4-kB C-SRAM testchip of 128-b words manufactured in 22-nm FD-SOI technology displays a subarray efficiency of 72% as well as an additional computing area of less than 5%. The measurements at 0.85 V and 1 GHz demonstrate an energy efficiency per unit area of 35.6 and 1.48 TOPS/W/mm2 for 8-b additions and multiplications with 3- and 24-ns computing latency, respectively.

A 35.6 TOPS/W/mm2 3-Stage Pipelined Computational SRAM with Adjustable Form Factor for Highly Data-Centric Applications

**Please read the paper on the following link:**

https://1worldcontent.com/ess/9042.pdf

**Abstract:**

This paper presents a systematic design framework for ADC optimization. Our emphasis is on a robust design that is highly repeatable, which is driven by a deep understanding of the behavior of circuit building blocks. A 10 b 500 MS/s single-channel SAR ADC designed in this framework displays uniform performance for inputs up to 2 GHz at state-of-the-art FoM, which demonstrates the power of design based on analytical expressions.

A Tutorial on Systematic Design of CMOS A/D Converters: Illustrated by a 10 b, 500 MS/s SAR ADC with 2 GHz RBW

**Please read the paper on the following link:**

https://1worldcontent.com/ess/9162.pdf

**Abstract:**

This paper presents a low-power and high-linearity noise-shaping SAR ADC that employs a duty-cycled amplifier and a mismatch error shaping technique. The power-efficient duty-cycled amplifier with 18x gain and two passive integrators provide 2nd-order noise shaping to improve in-band noise attenuation. Mismatch error shaping with a two-level digital prediction scheme is used to 1st-order shape the capacitive DAC mismatch errors without sacrificing the input signal range. The proposed ADC is fabricated in 65 nm CMOS technology and achieves 80 dB peak SNDR and 98 dB peak SFDR in a 31.25 kHz bandwidth, leading to a Schreier FoM of 176.3 dB.

An 80dB-SNDR 98dB-SFDR Noise-Shaping SAR ADC with Duty-Cycled Amplifier and Digital-Predicted Mismatch Error Shaping

**Please read the paper on the following link:**

https://1worldcontent.com/ess/9304.pdf

**Abstract:**

In this work, a 10b 400MS/s single-channel SAR ADC is reported. Without an auxiliary sub-ADC, a subranging architecture is proposed, where only one comparator is used with the subsetted capacitive DAC (CDAC), eliminating the mismatch of comparators and saving area. For the subranging process, a partial detect-and-skip (PDAS) switching scheme is proposed, which improves both power efficiency and linearity without delay overhead. In addition, the dynamic logic circuits, including dynamic asynchronous loop (DAL) and dynamic SAR logic (DSL), are improved to reduce the power and logic propagation delay. Fabricated in a 40 nm CMOS process, this single-channel prototype operates at an enhanced sampling rate of 400 MS/s. At Nyquist, 56.4 dB SNDR and 73.1 dB SFDR are achieved. The ADC draws 3.46mW from a single 1.2V supply, leading to a Walden FoM of 16.0fJ/ conversion-step.

A 9.08 ENOB 10b 400MS/s Subranging SAR ADC with Subsetted CDAC and PDAS in 40nm CMOS

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9204647

**Abstract:**

This paper provides guidelines to design porous silicon layers regarding optimization of small-signal properties in passive structures for RF: insertion loss and cross talk. Results are based on high frequency measurements on 200 mm wafers and electromagnetic simulations up to 40 GHz. Using substrate resistivity below 1 ohm.cm allows the best trade-off with minimized porous silicon thickness.

Influence of Substrate Resistivity on Porous Silicon Small Signal RF Properties

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9186848

**Abstract:**

To enable CMOS compatible GaN HEMTs for the next generation of communication systems (5G and beyond), a low gate resistance is of great importance since it directly affects the RF power gain and fMAX of the transistor. In this paper, the impact of various gate-metal stacks on the gate resistance and RF performance of the devices is studied. The optimized Ti-free gatemetal process leads to fMAX enhancement up to ~ 50% for devices scaled down to 0.32μm gate lengths. The gate resistance for the Tshaped gate is modelled from S-parameters and validated on various gate field plate geometries. The tradeoff between the gate resistance and parasitic capacitance in GaN HEMTs is highlighted in this case.

Analysis of Gate Metal Resistance in CMOS Compatible RF GaN HEMTs

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9146558

**Abstract:**

In this paper, an ultra-broadband D-band wireless front-end receiver (RX) in 45nm CMOS SOI is proposed. It achieves a Noise Figure of 8 dB, a Gain of 16 dB, a 3 dB bandwidth of 25 GHz, and occupies a compact area of 2 mm2. To our knowledge, for the first time, the required millimeter-wave Local Oscillator signal is generated on-chip. Furthermore, 108 Gb/s data-rate is demonstrated by receiving and demodulating a signal composed of 10×2.16 GHz channels with -40 dBm average power and 64 QAM modulation. With a consumption of 200 mW from a 1-V voltage supply, the proposed RX achieves an energy efficiency of 1.8 pJ/bit

A 108 Gb/S 64-QAM CMOS D-Band Rx with Integrated Lo Generation

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9178366

**Abstract:**

In this paper, an ultra-broadband D-band wireless front-end transmitter (TX) in 45 nm CMOS SOI is proposed. Based on channel bonding and 64-QAM modulation, it achieves 84.8 Gb/s data-rate by combining 8×2.16 GHz baseband channels. The eight baseband channels are aggregated at Intermediate Frequency (IF) in two sets of four channels and then up-converted to two adjacent sub-bands at D-band. The required millimeter-wave Local Oscillators (LO) are generated on-chip. The Intermediate Frequency band is 57.96 GHz to 66.66 GHz, and the considered transmission band is from 140.895 GHz to 158.265 GHz. The presented TX integrates two up-converter mixers, two power amplifiers and an on-chip power combiner in addition to the two LO generator with a total DC power consumption of 420 mW from a 1-V voltage supply, and occupies a compact active area of 2.98 mm2.

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